UV Laser Marking Machine
Product reference: MCH-00761
UV laser marking and engraving with limited heat effects serves food and pharmaceutical packaging, micro-drilling, glass separation and patterned silicon-wafer cutting. Many materials absorb the 355 nm wavelength; the source identifies copper as an exception, and substrate suitability should be tested.
- Printing and application surfaces
- Plastic substrates, Glass
- Containers and print media
- Labels & films
The printing or labeling system is selected for the application surface, code or label size, and production line speed.
Details & features
UV laser marking machine-AK-UV100
Applications
Mark on coated silicon solar panel, Remove the surface film on object:
Mark on mobile protection film, LCD screen , optic device, automobile glass etc:
glasses, clock ,PC, electronic device, PCB and control panel, nameplate and plastic material etc.
Technical specifications
Values depend on the model and configuration. Final specifications are confirmed with your quotation.
| Power | 15W |
|---|---|
| Laser wavelegth | 355 nm |
| Repetiton frequency | 20 -100 KHZ |
| TEMOOGaussian beam | <2 |
| Marking range | 100* 100mm |
| Marking depth | =0.4mm |
| Marking speed | =10000mm/s |
| Minimum line width | 0.01mm |
| Smaillest character | 0.15 mm |
| Repeat accuracy | ±0 .002 |
| Power supply | 220V /50Hz |
| Power consumpion | 500W |
| Demension | 570mm X 270mm X 200mm |
| Total weight | About 75 kg |
| Operating system | Win 732bit |
| Cooling way | Built- inair cooling |
| Control interface | Standard USB |
| File format | All the characters/fonts of WINDOWS operating system |
| Laser device type | Impulse UV laser device |
